全部
  • 全部
  • 产品管理
  • 新闻资讯
  • 介绍内容
  • 企业网点
  • 常见问题
  • 企业视频
  • 企业图册

中文  |  EN


Aijia Electronic Technology

Professional Focus And Dedication

PRODUCTS

Shanghai Aijia Electronic Technology Co., Ltd
+
  • aj_product_002(6).jpg

QFN Backside Tape

QFN Backside Tape

QFN Backside Tape (Liner / Liner-less type)

Category:

MTI Tape


Mssageboard

Details

QFN Backside Tape (Liner / Liner-less type)

 
 

QFN Backside Tape (Liner / Liner-less type)

 
 
Product Description

QFN (Backside Tape) tape is attached to the back of the lead frame to prevent leakage of EMC during EMC molding.

 
Application
  • Sputter & Spray for PKG EMI Shielding
  • QFN Leadframe backside tape
 
Film Properties
  • Good heat resistance, stable adhesion at high temperature
  • Residual and Excellent Wire-Bonding
  • No flash burr in EMC molding process
  • Superior Lead Frame Warpage Control
 
Product Structure

Previous

Previous