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Aijia Electronic Technology

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Shanghai Aijia Electronic Technology Co., Ltd
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UV Dicing Tape

UV Dicing Tape

UV Tape® for Wafer Dicing Process

Category:

MTI Tape


Mssageboard

Details

UV Dicing Tape

 

UV Dicing Tape

 
 
Product Description
  • To fix wafer with high adhesiveness when dicing process and easy to remove after UV cure with decreased adhesiveness
  • Remove without flouling on wafer surface
 
Application
  • LED Wafer Dicing / Semiconductor Wafer Dicing / Package(LED) Dicing
 
Product Structure

 
Properties
  • Strong adhesiveness, chipping, chip flying prevention
  • Removed easily when die pick-up with decrease adhesiveness after UV curing
  • Not remain damage or corruption on the surface of the product after UV curing
  • Semiconductor/LED/Glass Package & Wafer
  • PO, PE, PVC, PET Base Tape
  • Have functional product of Non UV type, expandable type

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