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产品名称

MWL Series

MWL Series for Backside Coating Tape
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产品描述

Backside Coating Tape (MWL SERIES-)

 

Backside Coating Tape (MWL SERIES-)

Product Description

A thermal adhesive tape capable of laser marking at the wafer level, capable of withstanding the dicing process, and ultimately capable of protecting the exposed backside of the chip

 
Key Features and benefits of MWL Tape
  • Lamination Process
  • Uniform Thickness : 25㎛, 50㎛
  • Reworking before heat curing (strength of adhesive after heat curing)
  • Protective dicing: no chipping and die cracks on backside
  • Die protection / reinforcement high modulus
  • Low transmittance: No light penetration at IR wavelength
Corresponding parameter set not found, please add it in property template of background
暂未实现,敬请期待
暂未实现,敬请期待
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