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Aijia Electronic Technology

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Shanghai Aijia Electronic Technology Co., Ltd
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Hyper-Pro

Hyper-Pro

【Wafer Blade Sawing Solution】 Surface Active Agent Products : Hyper-Pro ®

Category:

MTI Cleaner


Mssageboard

Details

Hyper-Pro ®

 

 

Surface Active Agent Products : Hyper-Pro ®

 
 
Selecting the Best Material
  • Reduce Surface Tension(31dynes/cm) and ESD effect control
  • Coating Shields formed upon the Wafer Surface
  • Prevent Particles from Surface deposition
  • Blade Wafer sawing Quality control from Die Chipping, Burr and crack
  • Reduce Temperature of Blade by lubrication, cutting and cooling that
  • prevent static electricity (Improve Blade Life time extend)
  • Non-ionic surface active agent : PH (6.5-8.5)
  • Environmental Standard Optimized : COD, BOD, ROHS
  • An exclusive Wafer Sawing Chemical  for specialized Corrosion and Galvanic Cell


 

 

 

Effect of Hyper-Pro ®

Galvanic Cell Test Result

GROUP Galvanic Cell Image
D.I
Water
     
Hyper-Pro      

[Note] Only DI Water, Per Line :  About  32ea Galvanic Cell  Occurrence With Hyper-Pro : Not detected  Galvanic Cell

 

 

For protect ESD resistivity Test

[Note] Resistivity is lower and lower, it could prevent electro static when wafer saw generated frictional electricity which discharges to outside, In case of Hyper-Pro that resistivity is very stable even if dilution rate were high.